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ANSYS SIwave from IDAC
ANSYS SIwave
 
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ANSYS SIwave
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ANSYS SIwave software analyzes the printed circuit boards (PCBs) and IC packages prevalent in modern electronic products. This includes packages merged onto boards for complete channel analysis. The tool allows you to perform complete signal- and power- integrity analyses from DC to beyond 10 Gb/s. SIwave extracts frequency-dependent circuit models of signal nets and power distribution networks directly from electrical CAD layout (ECAD) databases. These analyses aid in the identification of signal- and power-integrity problems and are critical to designers seeking first-pass system success. Entire design paths from package to board to package can be analyzed using a full-wave electromagnetic simulator that realizes coupling effects between packages and boards that are often ignored. With the IC die network modeler, first-order silicon effects can be included in the analyses for a complete channel description. The inclusion of Apache RedHawk™ die models enables analysis of dynamic switching effects.

SIwave 4.0: Excited with a 1.2V voltage source and predicting the near-field magnitude of magnetic field at 778 MHz.

SIwave 4.0: Excited with a 1.2V voltage source and predicting the near-field magnitude of magnetic field at 778 MHz.

SIwave employs specialized full-wave finite element engines to compute resonances, reflections, inter-trace coupling, simultaneous switching noise, power/ground bounce, DC voltage/current distributions as well as near- and far-field radiation patterns, on high-speed PCBs and complex IC packages. SIwave can extract complete designs (which include multiple, arbitrarily shaped power/ground layers, vias, signal traces and circuit elements) with unprecedented accuracy and speed - all without potentially laborious layout partitioning by the user.

 

Product Features Include:

Advanced Signal- and Power-Integrity Analysis

ANSYS SIwave employs specialised full-wave finite-element algorithms to compute resonances, reflections, inter-trace coupling, simultaneous switching noise, power/ground bounce, DC voltage/current distributions, near- and far-field radiation patterns on high-speed PCBs and complex IC packages.

Easy Layout Extraction

The SIwave tool can extract complete designs (which include multiple, arbitrarily shaped power/ground layers, vias, signal traces and circuit elements) with unprecedented accuracy and speed, without requiring potentially laborious layout partitioning by the user. SIwave extracts S-, Y-, and Z-parameters and IBIS interconnect models (ICM), displays 3-D electromagnetic fields and generates ANSYS Full-Wave SPICE models for subsequent time- and frequency-domain analyses within Ansoft DesignerSI, Ansoft DesignerRF, ANSYS Nexxim, ANSYS Simplorer or third-party SPICE-compatible circuit tools such as Synopsys® HSPICE® and Cadence® PSpice®.

Automated Decoupling Capacitor Optimisation

Full-wave electromagnetic decoupling analysis
ANSYS SIwave PI Advisor significantly improves engineering productivity by automating decoupling capacitor selection, placement and optimisation for printed circuit boards and IC packages. The underlying engine, based on sophisticated genetic algorithms,, allows the specification of various constraints (capacitor price, total number of capacitors, desired network impedance, etc.) for consideration in its cost function. Accurate frequency-dependent S-parameter capacitor models are utilized during simulation. In addition, the impact of capacitor physical location and mounting technique is captured by the full-wave SIwave extraction engine.

SIwave plots loop inductance between observation point and all capacitors on voltage plane.

SIwave plots loop inductance between observation point and all capacitors on voltage plane.

Once optimisation is complete, PI Advisor presents several decoupling schemes (each consisting of a set of capacitors) that meet the specified constraints. Engineers can browse the schemes and export a bill-of-materials (BoM) for those deemed to best meet their requirements. You can also superimpose a 3-D bar graph on the layout to indicate loop inductance values. This provides you with an immediate, intuitive understanding of each capacitor's effectiveness.

SimplePI lumped analysis
SimplePI lumped analysis provides a quick calculation to determine capacitor values and placement. This solution ascertains the lumped circuit equivalent of all the capacitors on a board or package and can be used to develop the best candidate capacitors for a given design. In addition it will automatically determine the best type and number of capacitors for a frequency-dependent impedance mask.

Powerful Post Processing Capabilities

ANSYS SIwave delivers powerful post-processing features to visualize, animate and report the results of your simulation. These results are:

  • S-parameters (single-ended, differential, de-embedded, renormalized)
  • Y and Z matrices
  • 2-D MoM "real-time" trace characterization (Zo, Td, R, L, C, G,)
  • TouchStone® output (s-parameters)
  • IBIS ICM output
  • Lumped RLGC output
  • ANSYS Full-Wave Spice output
  • Resonant cavity analysis
  • Near-field analyses
  • Far-field analyses

Easy to use modeling interface

SIwave software allows you to create layouts as well as modify imported PCB's and packages. The easy-to-use interface is layout based.

Table Impedance Calculator

This built-in tool quickly and easily allows you to display quantities such as Z0, net length, time delay and reference layer for any selected net. All possible paths (from each pin to every other pin on net) are displayed and sorted in descending order of path distance. Additionally, you can click on any individual path in the table so the variation in Z0 is graphically displayed and the selected path is highlighted in SIwave's main layout window.

Integrated and Automated DC I²R Reporting

An integrated I²R computation module allows you to perform pre- and post-layout DC voltage drop, DC current density and DC power density analyses. This will ensure that power distribution networks (PDN) can source the proper power to integrated circuits by making sure that the PDN has the proper bump, ball and pin sizes as well as proper copper weighting to minimize losses. Additionally, all this crucial information is automatically generated with a single button click.

Current and voltage distribution plots on VCC plane.

Current and voltage distribution plots on VCC plane.

Sophisticated EMI/EMC Capability

Electromagnetic interference/compatibility testing can be performed for both near- and far-field problems. SIwave utilizes algorithms from ANSYS HFSS to provide accurate, detailed descriptions of field interactions above and below boards and packages. Combining this with resonant mode simulations allows you to predict field radiation patterns prior to manufacturing to reduce the number of fabrication spins needed to meet your needs. SIwave provides valuable insight into sources of EMI that are not obtainable through measurements and provides confidence that any changes made will correct the problems found during testing. Coupling of SIwave with Ansoft Designer, ANSYS Nexxim and ANSYS HFSS delivers the unique ability to study data-dependent radiation patterns from PCBs and packages inside of a housing enclosure.

SIwave 4.0: SIwave cavity resonant plot detailing the potential difference (voltage) between the 1.8V DC plane and ground including all parasitics.

SIwave 4.0: SIwave cavity resonant plot detailing the potential difference (voltage) between the 1.8V DC plane and ground including all parasitics.

This SIwave cavity resonant plot details the potential difference (voltage) between the 1.8V DC plane and ground including all parasitics. Red indicates a large resonance that is yielding the largest potential difference between Vdd and ground where the FEM mesh is shown by the white triangles.

Advanced Broadband SPICE Model Generation

ANSYS Full-Wave SPICE provides frequency-dependent SPICE models for accurate time domain simulation in third party time-domain analysis tools. ANSYS Full-Wave SPICE models can be created for use with ANSYS Nexxim, HSPICE®, Spectre® RF and MATLAB®. Full-Wave SPICE is the only tool on the market that that produces highly accurate, high-bandwidth SPICE models at the touch of a button. This capability enables you to design electronic and communication components while taking Gigahertz-frequency effects into account.

Highly Accurate Macro Modeling

SIwave provides an unprecedented level of accuracy for complete board and package designs that enables full-channel transient simulation in multiple circuit simulator platforms. SIwave uses patent pending TWA technology so you can check and enforce passivity and causality. This technology eliminates errors introduced when trying to simulate time-domain circuit analyses using different simulation platforms. SPICE level models using HSPICE and PSpice syntax are supported along with native Nexxim and Simplorer state space models.

EDA Design Flow Integration

ANSYS SIwave seamlessly integrates into existing design flows by importing design geometry directly from EDA layout tools (such as Cadence Allegro®/APD, Sigrity Unified Package Designer™ (UPD), Mentor Graphics Board Station®, Expedition™ and PADS®, Zuken CR5000), and manufacturing standard ODB . The resulting SYZ networks or Full-Wave SPICE models can be imported into existing circuit tools, such as DesignerSI, DesignerRF, Simplorer or other SPICE-compatible tools.

Image showing CAD layout in SIwave.

High-Performance Computing SIwave

SIwave includes high-performance computing options that allow the solver to use multiple threads, cores and processors to solve large simulations with shorter solve times. This parallelisation helps enable full-packages-merged-to-board solutions for signal-integrity, power-integrity and electromagnetic interference.

Comprehensive Multiphysics

SIwave links with the ANSYS software portfolio for multiphysics simulation of electronic components. One option is the ability to export a power distribution map from SIwave into ANSYS Icepak. This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak simulation technology solves the challenges associated with the dissipation of thermal energy from electronic components that may cause premature component failure due to overheating.

 
             
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Heart and arterial flow field during heart muscle contraction Bisected view of rocket engine test stand
Example of EKM Enginering Knowledge Management product design steps for a washing machine. Courtesy of ESSS SIwave I2R solver showing the potential difference between the 2.5V DC plane and the chassic ground.
Turbulent flow structures around landing gear Thermal stress analysis of a computer graphics card.
Coupling ANSYS Icepak with ANSYS SIwave on printed circuit board. Component temperatures for a multi-layer PCB. Resistive losses for copper trace layers are imported from SIwave.
   
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