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ANSYS Icepak software provides robust and powerful computational fluid dynamics (CFD) for electronics thermal management. Based on the renowned ANSYS FLUENT solver, ANSYS Icepak combines advanced solver technology with robust meshing options designed to provide fast and accurate thermal results for electronics cooling applications.
For more than a decade, companies around the world have relied on ANSYS Icepak to carry out rapid heat transfer and fluid flow analysis of IC packages, printed circuit boards and complete electronic system as well as to perform easy validation of design modifications before building any physical prototypes.
Product Features Include:
ANSYS Icepak software contains many productivity-enhancement features that enable quick creation and simulation of electronics cooling models of integrated circuit (IC) packages, printed circuit boards and complete electronic systems.
Models are created by simply dragging and dropping icons of predefined objects — including cabinets, fans, packages, circuit boards, vents and heat sinks — to create models of complete electronic systems. These smart objects capture geometric information, material properties, meshing parameters and boundary conditions — all of which can be parametric for performing sensitivity studies and optimizing designs.
To accelerate model development, ANSYS Icepak imports both electronic CAD (ECAD) and mechanical CAD (MCAD) data from a variety of sources. ANSYS Icepak software directly supports IDF, MCM, BRD and TCB files that were created using EDA software such as Cadence® Allegro® or Cadence Allegro Package Designer. Additional products — AnsoftLinks and ANSYS Icegrb — enable ANSYS Icepak to import ECAD data from a number EDA packages from Cadence, Zuken®, Sigrity®, Synopsys® and Mentor Graphics®.
ANSYS Icepak directly supports the import of mechanical CAD data from neutral file formats including STEP and IGES files. ANSYS DesignModeler software allows ANSYS Icepak to import geometry from all major mechanical CAD packages through the ANSYS Workbench geometry interfaces. Geometry imported from ECAD and MCAD can be combined into smart objects to efficiently create models of electronic assemblies.
Flexible, Automatic Meshing
ANSYS Icepak software contains advanced meshing algorithms to automatically generate high-quality meshes that represent the true shape of electronic components. Options include hex-dominant, unstructured hexahedral and Cartesian meshing, which enable automatic generation of body-fitted meshes with minimal user intervention. The mesh density can be localized through nonconformal interfaces, which allows inclusion of a variety of component scales within the same electronics cooling model.
While fully automated, ANSYS Icepak contains many mesh controls that allow customization of the meshing parameters to refine the mesh and optimize the trade-off between computational cost and solution accuracy. This meshing flexibility results in the fastest solution times possible without compromising accuracy.
Robust Numerical Solutions
ANSYS Icepak software uses state-of-the-art technology available in the ANSYS FLUENT CFD solver for thermal and fluid flow calculations. The ANSYS Icepak solver solves for fluid flow and includes all modes of heat transfer — conduction, convection and radiation — for both steady-state and transient thermal flow simulations. The solver uses a multigrid scheme to accelerate solution convergence for conjugate heat transfer problems. It provides complete mesh flexibility and allows solution of even the most complex electronic assemblies using unstructured meshes — providing robust and extremely fast solution times.
ANSYS Icepak software contains a full suite of qualitative and quantitative post-processing tools to generate meaningful graphics, animations and reports that can readily convey simulation results to colleagues and customers. Visualisation of velocity vectors, temperature contours, fluid particle traces, isosurface displays, cut planes and x–y plots of results data are all available for interpreting the results of an electronics cooling simulation. Customised reports, including images, can be automatically created for distributing results data, identifying trends in the simulation, and reporting fan and blower operating points. ANSYS Icepak includes ANSYS CFD-Post for further post-processing of CFD results with advanced post-processing and animation tools.
Automated DELPHI Package Characterisation
ANSYS Icepak contains an automated procedure for DELPHI package characterisation from a detailed package model. The software runs different boundary condition scenarios to obtain temperature and heat flux values, which are used to create an optimised thermal network model. The optimised DELPHI network model can easily be included in a system-level simulation, which allows accurate prediction of junction temperatures of IC components in a system-level thermal simulation.
Automated Computation of Thermal Conductivity
Based on imported ECAD data, ANSYS Icepak software can extract detailed thermal conductivity maps for printed circuit boards and packages. For printed circuit boards, localized orthotropic thermal conductivity can be determined from the electronic trace and via information for the printed circuit board layers. This enables accurate representation of thermal conduction in the board, which provides increased fidelity in predicting internal temperatures and component junction temperatures.
ANSYS Icepak provides a link with SIwave software to account for heating due to copper resistive losses in printed circuit boards and packages. SIwave allows performance of complete signal- and power-integrity analyses from DC to beyond 10 Gb/s. The connection permits importing the DC power distribution profile from SIwave into ANSYS Icepak for thermal analysis. The coupling also enables prediction of both internal temperatures and accurate component junction temperatures.
Structural Simulation Interface
Following an ANSYS Icepak simulation, temperature data from a thermal-flow analysis can be imported into an ANSYS structural mechanics product using the ANSYS Workbench platform. ANSYS structural mechanics software provides a comprehensive set of capabilities for modeling both linear and nonlinear structural mechanics for both static and dynamic systems. The coupling between ANSYS Icepak and structural mechanics allows users to evaluate the temperatures and resulting thermal stresses of electronic components.
ANSYS Icepak includes many macros designed to automate common model-building tasks. Macros are available to assist with creating different types of packages, PCBs, heat sinks, heat pipes, thermoelectric coolers, JEDEC test configurations and DELPHI package characterization.
Vast libraries of standard electronic components are included with ANSYS Icepak software. These libraries allow rapid creation of electronics cooling models. Libraries include data for:
ANSYS HPC provides powerful parallel performance computing options to solve large-scale electronics cooling models. Calculation speed can be drastically increased by performing simulations in parallel, either on a multicore machine or distributed over a large computing cluster.ANSYS DesignModeler
The ANSYS DesignModeler tool enables the import, simplification and conversion of mechanical CAD into native ANSYS Icepak objects. Within the ANSYS Workbench platform, ANSYS DesignModeler allows import of geometry from all major mechanical CAD vendors through the ANSYS Workbench geometry interfaces. Imported geometry can easily be simplified for thermal analysis using both the automatic and manual geometry editing and simplification tools available in ANSYS DesignModeler.AnsoftLinks
AnsoftLinks software allows the import of electronic CAD data from EDA layout tools into ANSYS Icepak for thermal analysis. With AnsoftLinks, selected components from electronic packages or printed circuit boards can be converted into an Ansoft neutral file, which can then be imported into ANSYS Icepak. AnsoftLinks supports the conversion of EDA data from a number of tools offered by Cadence, Zuken, Sigrity and Mentor Graphics.ANSYS Iceopt
ANSYS Iceopt software provides robust design optimisation capabilities for ANSYS Icepak, extending parametric capabilities to allow for performance of in-depth design analysis and optimisation of electronic components.ANSYS Icegrb
ANSYS Icegrb software enables the import of Gerber files from EDA tools such as Cadence®, Zuken™, Sigrity® and Mentor Graphics® into ANSYS Icepak for the thermal analysis of printed circuit boards and packages.
|This image shows a printed circuit board with many components and
heat sinks on it. It is cooled by the two fans at the corners.
|This image was created by ANSYS Icepak. 21 printed circuit cards
are air cooled in the enclosure.
|12 PCBs that are cooled by four blowers at the top of the enclosure.
Shown are PCB temperatures and air streamlines
|Shown are air flow results of a fan integrated heat sink. Moving reference
Frame was used to accurately represent the rotating fan blades.
| ANSYS 15.0 Capabilities
Chart | Download
|Staying Cool with ANSYS Icepak